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|
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Дата |
|---|
| 18:49 |
| 24.02.2026 |
| 23.02.2026 |
| 20.02.2026 |
| 19.02.2026 |
| 18.02.2026 |
| 17.02.2026 |
| 13.02.2026 |
| 12.02.2026 |
| 11.02.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
117.43
|
117.69
|
118.00
|
116.92
|
119.09
|
117.56
|
|
|
81 765 814.94
|
11 772.00
|
|
114.01
|
117.00
|
112.39
|
112.39
|
117.91
|
116.79
|
|
|
281 151 654.94
|
38 242.00
|
|
111.60
|
113.00
|
112.75
|
110.10
|
113.74
|
111.58
|
|
|
261 272 608.18
|
29 313.00
|
|
111.05
|
113.95
|
111.67
|
111.2401
|
116.20
|
113.46
|
|
|
250 284 822.79
|
34 056.00
|
|
111.00
|
113.00
|
114.61
|
110.54
|
115.10
|
112.86
|
|
|
186 642 753.16
|
25 936.00
|
|
114.25
|
115.00
|
111.84
|
111.65
|
117.15
|
115.25
|
|
|
394 188 451.69
|
39 801.00
|
|
112.00
|
113.00
|
110.93
|
108.08
|
113.22
|
111.94
|
|
|
216 204 671.14
|
30 635.00
|
|
111.25
|
114.00
|
109.04
|
108.07
|
113.88
|
111.69
|
|
|
307 597 929.95
|
39 517.00
|
|
109.00
|
110.65
|
115.47
|
107.57
|
117.69
|
108.54
|
|
|
295 246 179.87
|
45 587.00
|
|
116.00
|
116.70
|
110.62
|
109.06
|
114.88
|
114.51
|
|
|
338 770 186.37
|
47 695.00
|
Qnity Electronics, Inc. is engaged in providing materials and solutions for semiconductor and electronics industries. The Company has two business segments, namely Semiconductor Technologies and Interconnect Solutions. The Semiconductor Technologies segment provides a portfolio of materials and solutions utilized across multiple stages of the semiconductor manufacturing process. These materials are integrated into customers’ roadmaps and are intended to support improvements in chip performance, production yield, and the implementation of advanced node technologies. The Interconnect Solutions segment offers a comprehensive range of material solutions that address the complexities of signal integrity, thermal and power management, and advanced packaging.
These solutions are used in advanced electronics hardware applications, including complex printed circuit boards and advanced semiconductor packaging.
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