|
|
|
|
Дата |
|---|
| 05.06.2026 |
| 04.06.2026 |
| 03.06.2026 |
| 02.06.2026 |
| 01.06.2026 |
| 29.05.2026 |
| 28.05.2026 |
| 27.05.2026 |
| 26.05.2026 |
| 22.05.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
140.22
|
145.50
|
150.00
|
141.47
|
150.255
|
142.05
|
|
|
269 251 735.48
|
36 038.00
|
|
151.45
|
153.93
|
151.43
|
150.10
|
156.89
|
154.80
|
|
|
193 880 278.34
|
24 283.00
|
|
153.00
|
154.00
|
155.61
|
154.95
|
159.33
|
155.00
|
|
|
269 981 525.85
|
26 706.00
|
|
151.77
|
155.73
|
153.37
|
152.42
|
156.64
|
155.74
|
|
|
382 319 162.11
|
32 080.00
|
|
150.00
|
151.80
|
152.10
|
148.9201
|
154.50
|
151.92
|
|
|
333 441 630.38
|
39 259.00
|
|
155.00
|
159.95
|
159.00
|
154.50
|
160.95
|
156.00
|
|
|
390 306 851.46
|
29 744.00
|
|
158.49
|
160.40
|
160.00
|
155.95
|
160.4999
|
158.96
|
|
|
221 894 397.14
|
27 624.00
|
|
158.00
|
161.15
|
166.51
|
157.00
|
167.06
|
159.11
|
|
|
272 134 792.02
|
31 805.00
|
|
165.00
|
166.00
|
161.38
|
159.003
|
165.25
|
164.57
|
|
|
258 075 710.01
|
32 114.00
|
|
155.10
|
156.85
|
155.00
|
153.29
|
157.74
|
156.93
|
|
|
244 965 706.06
|
26 314.00
|
Qnity Electronics, Inc. is engaged in providing materials and solutions for semiconductor and electronics industries. The Company has two business segments, namely Semiconductor Technologies and Interconnect Solutions. The Semiconductor Technologies segment provides a portfolio of materials and solutions utilized across multiple stages of the semiconductor manufacturing process. These materials are integrated into customers’ roadmaps and are intended to support improvements in chip performance, production yield, and the implementation of advanced node technologies. The Interconnect Solutions segment offers a comprehensive range of material solutions that address the complexities of signal integrity, thermal and power management, and advanced packaging.
These solutions are used in advanced electronics hardware applications, including complex printed circuit boards and advanced semiconductor packaging.
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