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Дата |
|---|
| 26.06.2026 |
| 25.06.2026 |
| 24.06.2026 |
| 23.06.2026 |
| 22.06.2026 |
| 18.06.2026 |
| 17.06.2026 |
| 16.06.2026 |
| 15.06.2026 |
| 12.06.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
157.00
|
158.00
|
161.23
|
155.50
|
162.52
|
158.20
|
|
|
302 012 267.20
|
34 051.00
|
|
167.00
|
169.00
|
166.00
|
159.40
|
170.00
|
167.49
|
|
|
225 374 855.78
|
28 396.00
|
|
164.00
|
165.88
|
162.16
|
156.16
|
165.59
|
158.73
|
|
|
283 289 144.45
|
38 739.00
|
|
162.00
|
166.00
|
163.98
|
160.0779
|
167.13
|
161.19
|
|
|
393 506 508.81
|
51 227.00
|
|
176.00
|
176.57
|
174.96
|
170.37
|
177.2799
|
175.64
|
|
|
716 142 618.78
|
62 830.00
|
|
173.40
|
173.80
|
160.45
|
159.50
|
170.07
|
168.98
|
|
|
951 775 472.18
|
65 111.00
|
|
156.00
|
160.00
|
156.20
|
156.20
|
162.85
|
156.72
|
|
|
357 917 851.66
|
38 137.00
|
|
152.00
|
154.90
|
159.44
|
152.17
|
160.54
|
152.24
|
|
|
210 896 638.18
|
29 674.00
|
|
160.00
|
162.00
|
157.40
|
153.75
|
161.83
|
161.02
|
|
|
260 907 667.74
|
35 232.00
|
|
147.00
|
153.00
|
148.86
|
147.02
|
152.49
|
150.65
|
|
|
203 597 723.69
|
28 651.00
|
Qnity Electronics, Inc. is engaged in providing materials and solutions for semiconductor and electronics industries. The Company has two business segments, namely Semiconductor Technologies and Interconnect Solutions. The Semiconductor Technologies segment provides a portfolio of materials and solutions utilized across multiple stages of the semiconductor manufacturing process. These materials are integrated into customers’ roadmaps and are intended to support improvements in chip performance, production yield, and the implementation of advanced node technologies. The Interconnect Solutions segment offers a comprehensive range of material solutions that address the complexities of signal integrity, thermal and power management, and advanced packaging.
These solutions are used in advanced electronics hardware applications, including complex printed circuit boards and advanced semiconductor packaging.
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