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|
|
|
Дата |
|---|
| 22:11 |
| 05.10.2026 |
| 02.10.2026 |
| 01.10.2026 |
| 30.09.2026 |
| 29.09.2026 |
| 28.09.2026 |
| 25.09.2026 |
| 24.09.2026 |
| 23.09.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
132.49
|
132.61
|
132.50
|
130.49
|
132.80
|
132.57
|
|
|
88 447 059.67
|
16 218.00
|
|
129.21
|
134.00
|
133.87
|
130.03
|
133.87
|
131.53
|
|
|
251 852 510.04
|
32 691.00
|
|
129.02
|
132.74
|
131.67
|
130.00
|
132.41
|
131.48
|
|
|
153 055 122.38
|
25 243.00
|
|
123.00
|
128.75
|
125.03
|
123.441
|
128.50
|
128.45
|
|
|
165 266 696.13
|
27 962.00
|
|
122.04
|
125.69
|
126.38
|
124.24
|
126.96
|
125.74
|
|
|
189 278 152.33
|
24 733.00
|
|
125.72
|
128.00
|
126.81
|
124.84
|
127.77
|
125.61
|
|
|
90 312 271.55
|
18 307.00
|
|
121.00
|
127.00
|
124.68
|
122.22
|
126.50
|
124.91
|
|
|
148 070 920.06
|
22 504.00
|
|
121.00
|
125.44
|
122.58
|
121.80
|
125.39
|
124.69
|
|
|
103 126 920.07
|
20 934.00
|
|
120.00
|
121.90
|
122.03
|
120.05
|
123.45
|
122.31
|
|
|
181 481 579.31
|
23 564.00
|
|
122.75
|
126.90
|
124.51
|
122.7016
|
126.55
|
124.50
|
|
|
113 891 897.45
|
20 571.00
|
Qnity Electronics, Inc. is engaged in providing materials and solutions for semiconductor and electronics industries. The Company has two business segments, namely Semiconductor Technologies and Interconnect Solutions. The Semiconductor Technologies segment provides a portfolio of materials and solutions utilized across multiple stages of the semiconductor manufacturing process. These materials are integrated into customers’ roadmaps and are intended to support improvements in chip performance, production yield, and the implementation of advanced node technologies. The Interconnect Solutions segment offers a comprehensive range of material solutions that address the complexities of signal integrity, thermal and power management, and advanced packaging.
These solutions are used in advanced electronics hardware applications, including complex printed circuit boards and advanced semiconductor packaging.
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