Показано 0 из 0
Дата |
---|
30.04.2024 |
29.04.2024 |
26.04.2024 |
25.04.2024 |
24.04.2024 |
23.04.2024 |
22.04.2024 |
19.04.2024 |
18.04.2024 |
17.04.2024 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
---|---|---|---|---|---|---|---|
|
|
8.28
|
8.08
|
8.35
|
8.25
|
|
|
70 557 218.00
|
|
|
|
8.10
|
8.00
|
8.40
|
8.33
|
|
|
74 791 228.00
|
|
|
|
8.08
|
7.88
|
8.10
|
8.03
|
|
|
85 148 381.00
|
|
|
|
7.76
|
7.69
|
8.20
|
7.98
|
|
|
96 151 084.00
|
|
|
|
7.57
|
7.50
|
7.82
|
7.81
|
|
|
76 528 183.00
|
|
|
|
7.76
|
7.48
|
7.87
|
7.57
|
|
|
116 312 339.00
|
|
|
|
7.48
|
7.36
|
8.04
|
7.97
|
|
|
89 379 386.00
|
|
|
|
7.83
|
7.46
|
7.84
|
7.56
|
|
|
64 910 793.00
|
|
|
|
7.66
|
7.46
|
7.99
|
7.87
|
|
|
71 000 751.00
|
|
|
|
7.24
|
7.24
|
7.71
|
7.67
|
|
|
66 186 903.00
|
|
Union Semiconductor (Hefei) Co., Ltd. offers integrated circuits package test services. The Company provides wafer testing, back end chip on glass package, rear glass cladding packaging, film coating packaging, and other services. Union Semiconductor (Hefei) provides its services throughout China.