Показано 0 из 0
Дата |
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03.05.2024 |
02.05.2024 |
30.04.2024 |
29.04.2024 |
26.04.2024 |
25.04.2024 |
24.04.2024 |
23.04.2024 |
22.04.2024 |
19.04.2024 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
---|---|---|---|---|---|---|---|
|
|
39 100.00
|
37 950.00
|
39 350.00
|
38 250.00
|
|
|
44 056 573 400.00
|
|
|
|
38 800.00
|
38 500.00
|
39 450.00
|
38 700.00
|
|
|
36 992 606 800.00
|
|
|
|
40 500.00
|
39 250.00
|
40 500.00
|
39 550.00
|
|
|
33 870 892 200.00
|
|
|
|
39 100.00
|
39 050.00
|
40 500.00
|
40 200.00
|
|
|
77 332 343 000.00
|
|
|
|
40 750.00
|
38 400.00
|
40 950.00
|
38 700.00
|
|
|
127 440 556 500.00
|
|
|
|
41 500.00
|
40 100.00
|
42 100.00
|
40 300.00
|
|
|
55 439 654 800.00
|
|
|
|
43 000.00
|
42 300.00
|
43 700.00
|
42 350.00
|
|
|
52 142 300 650.00
|
|
|
|
44 700.00
|
42 100.00
|
44 750.00
|
42 100.00
|
|
|
44 723 977 250.00
|
|
|
|
43 150.00
|
43 000.00
|
44 750.00
|
43 750.00
|
|
|
57 143 578 850.00
|
|
|
|
43 100.00
|
41 300.00
|
44 250.00
|
43 950.00
|
|
|
76 494 197 600.00
|
|
HPSP Co., Ltd. manufactures and distributes semiconductor machines and equipment. The Company produces high pressure heat treatment semiconductor equipment, silicon chips, thermal processing advance machines, oxidation devices, and other related products.