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Дата |
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08.05.2024 |
07.05.2024 |
03.05.2024 |
02.05.2024 |
30.04.2024 |
29.04.2024 |
26.04.2024 |
25.04.2024 |
24.04.2024 |
23.04.2024 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
---|---|---|---|---|---|---|---|
|
|
7 400.00
|
7 250.00
|
7 560.00
|
7 360.00
|
|
|
2 098 357 200.00
|
|
|
|
7 660.00
|
7 430.00
|
7 680.00
|
7 430.00
|
|
|
3 055 465 500.00
|
|
|
|
7 760.00
|
7 430.00
|
7 760.00
|
7 520.00
|
|
|
4 279 215 120.00
|
|
|
|
7 700.00
|
7 410.00
|
7 720.00
|
7 720.00
|
|
|
7 236 681 720.00
|
|
|
|
7 220.00
|
7 190.00
|
7 670.00
|
7 430.00
|
|
|
10 455 360 960.00
|
|
|
|
7 180.00
|
7 130.00
|
7 300.00
|
7 220.00
|
|
|
4 802 348 880.00
|
|
|
|
6 540.00
|
6 540.00
|
7 470.00
|
7 070.00
|
|
|
19 496 983 010.00
|
|
|
|
6 430.00
|
6 310.00
|
6 540.00
|
6 420.00
|
|
|
399 763 680.00
|
|
|
|
6 300.00
|
6 300.00
|
6 620.00
|
6 510.00
|
|
|
1 426 056 220.00
|
|
|
|
6 390.00
|
6 210.00
|
6 420.00
|
6 230.00
|
|
|
748 244 940.00
|
|
Duksan Hi-Metal Co., Ltd. manufactures OLED, conductive ball, and solder powder used in the semiconductor packaging process. The Company also produces compact camera module for mobile phone camera.