|
|
|
|
Дата |
|---|
| 23.06.2026 |
| 22.06.2026 |
| 19.06.2026 |
| 18.06.2026 |
| 17.06.2026 |
| 16.06.2026 |
| 15.06.2026 |
| 12.06.2026 |
| 11.06.2026 |
| 10.06.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
296.60
|
298.00
|
311.00
|
295.20
|
313.10
|
296.80
|
|
|
160 192 118.80
|
12 132.00
|
|
319.80
|
322.00
|
312.70
|
312.40
|
324.00
|
320.30
|
|
|
148 046 472.75
|
8 672.00
|
|
308.70
|
310.00
|
316.60
|
306.50
|
319.70
|
309.80
|
|
|
273 187 772.95
|
11 830.00
|
|
312.00
|
318.00
|
308.00
|
305.10
|
317.80
|
317.80
|
|
|
201 366 639.55
|
15 186.00
|
|
304.00
|
310.90
|
301.00
|
297.90
|
310.10
|
310.10
|
|
|
107 057 388.45
|
8 034.00
|
|
296.50
|
299.00
|
315.90
|
295.50
|
316.30
|
298.90
|
|
|
153 023 565.25
|
11 584.00
|
|
314.00
|
316.60
|
328.00
|
311.60
|
328.40
|
314.30
|
|
|
111 684 361.30
|
7 954.00
|
|
312.30
|
318.00
|
315.00
|
306.10
|
317.00
|
317.00
|
|
|
134 805 827.20
|
8 287.00
|
|
306.50
|
312.00
|
293.80
|
293.80
|
314.40
|
307.90
|
|
|
201 085 835.00
|
17 563.00
|
|
287.00
|
290.00
|
287.20
|
282.50
|
295.10
|
288.80
|
|
|
118 724 352.40
|
9 028.00
|
Период |
|---|
| 2026, регулярные |
| 2025, регулярные |
| 2024, регулярные |
| 2019, регулярные |
| 2018, регулярные |
| 2017, регулярные |
| 2016, Внеплановые |
| 2016, регулярные |
| 2015, Внеплановые |
| 2015, регулярные |
|
Экс-дивидендная дата
|
Закрытие реестра |
Сумма выплаты |
|---|---|---|
|
27.04.2026
|
28.04.2026 |
1.58 EUR |
|
25.04.2025
|
28.04.2025 |
2.18 EUR |
|
29.04.2024
|
30.04.2024 |
2.15 EUR |
|
05.05.2020
|
06.05.2020 |
1.01 EUR |
|
30.04.2019
|
02.05.2019 |
1.67 EUR |
|
28.04.2018
|
02.05.2018 |
4.64 EUR |
|
03.05.2017
|
04.05.2017 |
0.35 EUR |
|
03.05.2017
|
04.05.2017 |
1.39 EUR |
|
03.05.2016
|
04.05.2016 |
0.2 EUR |
|
03.05.2016
|
04.05.2016 |
1 EUR |
BE Semiconductor Industries N.V. produces integrated semiconductor assembly equipment. The Company designs, develops, manufactures, markets, and services machines that manufacture semiconductor packages, which provide the connection between the chip and other electronic components and protect the chip.
