|
|
|
|
Дата |
|---|
| 03.06.2026 |
| 02.06.2026 |
| 01.06.2026 |
| 29.05.2026 |
| 28.05.2026 |
| 27.05.2026 |
| 26.05.2026 |
| 25.05.2026 |
| 22.05.2026 |
| 21.05.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
288.00
|
288.40
|
287.00
|
282.70
|
292.90
|
288.40
|
|
|
102 045 760.50
|
6 949.00
|
|
286.00
|
287.00
|
282.10
|
277.20
|
286.70
|
286.20
|
|
|
106 632 653.85
|
6 458.00
|
|
278.00
|
279.90
|
282.90
|
274.40
|
286.90
|
278.20
|
|
|
98 143 719.55
|
6 945.00
|
|
282.40
|
286.00
|
286.50
|
281.80
|
291.10
|
284.40
|
|
|
165 234 442.15
|
5 618.00
|
|
282.00
|
288.00
|
278.60
|
278.50
|
287.60
|
287.60
|
|
|
99 078 649.90
|
6 247.00
|
|
276.00
|
279.50
|
285.90
|
274.10
|
286.80
|
276.40
|
|
|
150 832 150.15
|
8 828.00
|
|
283.50
|
288.00
|
285.00
|
281.10
|
288.60
|
284.00
|
|
|
114 489 266.90
|
7 226.00
|
|
281.00
|
282.60
|
278.10
|
274.40
|
283.40
|
282.00
|
|
|
59 582 405.70
|
3 472.00
|
|
273.40
|
274.00
|
275.00
|
271.70
|
278.50
|
273.60
|
|
|
114 411 438.40
|
7 001.00
|
|
269.70
|
270.40
|
265.50
|
264.70
|
273.50
|
270.40
|
|
|
92 134 603.55
|
5 971.00
|
Период |
|---|
| 2026, регулярные |
| 2025, регулярные |
| 2024, регулярные |
| 2019, регулярные |
| 2018, регулярные |
| 2017, регулярные |
| 2016, Внеплановые |
| 2016, регулярные |
| 2015, Внеплановые |
| 2015, регулярные |
|
Экс-дивидендная дата
|
Закрытие реестра |
Сумма выплаты |
|---|---|---|
|
27.04.2026
|
28.04.2026 |
1.58 EUR |
|
25.04.2025
|
28.04.2025 |
2.18 EUR |
|
29.04.2024
|
30.04.2024 |
2.15 EUR |
|
05.05.2020
|
06.05.2020 |
1.01 EUR |
|
30.04.2019
|
02.05.2019 |
1.67 EUR |
|
28.04.2018
|
02.05.2018 |
4.64 EUR |
|
03.05.2017
|
04.05.2017 |
0.35 EUR |
|
03.05.2017
|
04.05.2017 |
1.39 EUR |
|
03.05.2016
|
04.05.2016 |
0.2 EUR |
|
03.05.2016
|
04.05.2016 |
1 EUR |
BE Semiconductor Industries N.V. produces integrated semiconductor assembly equipment. The Company designs, develops, manufactures, markets, and services machines that manufacture semiconductor packages, which provide the connection between the chip and other electronic components and protect the chip.
