|
|
|
|
Дата |
|---|
| 18:40 |
| 25.08.2026 |
| 24.08.2026 |
| 21.08.2026 |
| 20.08.2026 |
| 19.08.2026 |
| 18.08.2026 |
| 17.08.2026 |
| 14.08.2026 |
| 13.08.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
198.60
|
199.80
|
210.00
|
194.70
|
210.30
|
199.20
|
|
|
177 626 686.80
|
17 982.00
|
|
198.60
|
199.80
|
210.00
|
194.70
|
210.30
|
199.20
|
|
|
177 626 686.80
|
17 982.00
|
|
207.00
|
209.00
|
207.80
|
205.70
|
213.90
|
208.00
|
|
|
63 609 286.55
|
5 279.00
|
|
211.00
|
213.00
|
213.30
|
210.10
|
216.30
|
212.80
|
|
|
56 398 282.20
|
4 517.00
|
|
210.20
|
213.00
|
214.10
|
209.40
|
216.20
|
210.80
|
|
|
78 085 875.15
|
8 590.00
|
|
212.00
|
214.00
|
222.90
|
211.90
|
224.00
|
212.20
|
|
|
91 348 600.05
|
7 659.00
|
|
222.00
|
223.50
|
232.40
|
222.10
|
234.00
|
222.30
|
|
|
86 256 071.55
|
6 331.00
|
|
237.30
|
238.50
|
240.20
|
236.30
|
241.90
|
237.80
|
|
|
76 168 269.05
|
5 008.00
|
|
233.00
|
234.50
|
234.50
|
233.00
|
239.10
|
233.50
|
|
|
73 358 146.45
|
5 615.00
|
|
234.00
|
236.00
|
233.50
|
229.30
|
236.10
|
235.20
|
|
|
107 167 943.10
|
5 829.00
|
Период |
|---|
| 2026, регулярные |
| 2025, регулярные |
| 2024, регулярные |
| 2019, регулярные |
| 2018, регулярные |
| 2017, регулярные |
| 2016, Внеплановые |
| 2016, регулярные |
| 2015, Внеплановые |
| 2015, регулярные |
|
Экс-дивидендная дата
|
Закрытие реестра |
Сумма выплаты |
|---|---|---|
|
27.04.2026
|
28.04.2026 |
1.58 EUR |
|
25.04.2025
|
28.04.2025 |
2.18 EUR |
|
29.04.2024
|
30.04.2024 |
2.15 EUR |
|
05.05.2020
|
06.05.2020 |
1.01 EUR |
|
30.04.2019
|
02.05.2019 |
1.67 EUR |
|
28.04.2018
|
02.05.2018 |
4.64 EUR |
|
03.05.2017
|
04.05.2017 |
0.35 EUR |
|
03.05.2017
|
04.05.2017 |
1.39 EUR |
|
03.05.2016
|
04.05.2016 |
0.2 EUR |
|
03.05.2016
|
04.05.2016 |
1 EUR |
BE Semiconductor Industries N.V. produces integrated semiconductor assembly equipment. The Company designs, develops, manufactures, markets, and services machines that manufacture semiconductor packages, which provide the connection between the chip and other electronic components and protect the chip.
