|
|
|
|
Дата |
|---|
| 04.08.2026 |
| 03.08.2026 |
| 31.07.2026 |
| 30.07.2026 |
| 29.07.2026 |
| 28.07.2026 |
| 27.07.2026 |
| 24.07.2026 |
| 23.07.2026 |
| 22.07.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
216.50
|
218.00
|
208.20
|
207.30
|
217.80
|
217.70
|
|
|
141 263 962.05
|
10 241.00
|
|
200.00
|
202.00
|
200.70
|
194.10
|
203.00
|
201.40
|
|
|
96 525 530.23
|
9 509.00
|
|
196.50
|
199.90
|
205.00
|
194.55
|
205.90
|
198.25
|
|
|
168 143 188.48
|
13 340.00
|
|
196.00
|
198.60
|
190.65
|
187.35
|
198.85
|
197.50
|
|
|
176 711 610.38
|
15 803.00
|
|
189.25
|
194.40
|
192.15
|
188.50
|
201.90
|
189.50
|
|
|
142 272 229.65
|
15 577.00
|
|
195.00
|
199.00
|
199.75
|
193.35
|
204.60
|
197.80
|
|
|
177 729 579.58
|
16 210.00
|
|
204.80
|
208.50
|
225.10
|
203.90
|
225.30
|
205.10
|
|
|
168 101 156.65
|
13 552.00
|
|
223.00
|
227.90
|
223.30
|
220.30
|
229.30
|
227.00
|
|
|
114 290 805.85
|
9 304.00
|
|
227.30
|
231.00
|
244.10
|
227.30
|
246.00
|
229.90
|
|
|
166 340 155.10
|
13 969.00
|
|
247.00
|
249.00
|
237.30
|
235.20
|
249.00
|
248.10
|
|
|
166 649 911.40
|
9 007.00
|
Период |
|---|
| 2026, регулярные |
| 2025, регулярные |
| 2024, регулярные |
| 2019, регулярные |
| 2018, регулярные |
| 2017, регулярные |
| 2016, Внеплановые |
| 2016, регулярные |
| 2015, Внеплановые |
| 2015, регулярные |
|
Экс-дивидендная дата
|
Закрытие реестра |
Сумма выплаты |
|---|---|---|
|
27.04.2026
|
28.04.2026 |
1.58 EUR |
|
25.04.2025
|
28.04.2025 |
2.18 EUR |
|
29.04.2024
|
30.04.2024 |
2.15 EUR |
|
05.05.2020
|
06.05.2020 |
1.01 EUR |
|
30.04.2019
|
02.05.2019 |
1.67 EUR |
|
28.04.2018
|
02.05.2018 |
4.64 EUR |
|
03.05.2017
|
04.05.2017 |
0.35 EUR |
|
03.05.2017
|
04.05.2017 |
1.39 EUR |
|
03.05.2016
|
04.05.2016 |
0.2 EUR |
|
03.05.2016
|
04.05.2016 |
1 EUR |
BE Semiconductor Industries N.V. produces integrated semiconductor assembly equipment. The Company designs, develops, manufactures, markets, and services machines that manufacture semiconductor packages, which provide the connection between the chip and other electronic components and protect the chip.
