|
|
|
|
Дата |
|---|
| 18:40 |
| 15.07.2026 |
| 14.07.2026 |
| 13.07.2026 |
| 10.07.2026 |
| 09.07.2026 |
| 08.07.2026 |
| 07.07.2026 |
| 06.07.2026 |
| 03.07.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
242.10
|
244.20
|
255.00
|
241.50
|
258.80
|
244.00
|
|
|
90 809 321.40
|
7 255.00
|
|
242.10
|
244.20
|
255.00
|
241.50
|
258.80
|
244.00
|
|
|
90 809 321.40
|
7 255.00
|
|
250.20
|
253.00
|
245.00
|
244.10
|
253.20
|
251.60
|
|
|
80 034 404.35
|
5 209.00
|
|
246.00
|
247.50
|
247.00
|
243.50
|
251.50
|
247.00
|
|
|
74 856 538.50
|
5 803.00
|
|
251.50
|
255.50
|
249.90
|
249.20
|
255.40
|
255.30
|
|
|
72 551 952.60
|
5 170.00
|
|
252.00
|
255.00
|
248.00
|
247.70
|
256.60
|
254.80
|
|
|
86 629 849.85
|
6 158.00
|
|
239.60
|
242.50
|
242.00
|
237.60
|
245.60
|
241.30
|
|
|
103 179 729.20
|
10 733.00
|
|
240.00
|
242.40
|
249.30
|
238.20
|
251.90
|
241.90
|
|
|
135 278 560.65
|
12 740.00
|
|
256.00
|
259.00
|
256.20
|
250.30
|
259.00
|
258.10
|
|
|
190 384 130.05
|
13 930.00
|
|
272.80
|
273.10
|
266.20
|
266.20
|
275.10
|
273.10
|
|
|
61 378 148.05
|
5 197.00
|
Период |
|---|
| 2026, регулярные |
| 2025, регулярные |
| 2024, регулярные |
| 2019, регулярные |
| 2018, регулярные |
| 2017, регулярные |
| 2016, Внеплановые |
| 2016, регулярные |
| 2015, Внеплановые |
| 2015, регулярные |
|
Экс-дивидендная дата
|
Закрытие реестра |
Сумма выплаты |
|---|---|---|
|
27.04.2026
|
28.04.2026 |
1.58 EUR |
|
25.04.2025
|
28.04.2025 |
2.18 EUR |
|
29.04.2024
|
30.04.2024 |
2.15 EUR |
|
05.05.2020
|
06.05.2020 |
1.01 EUR |
|
30.04.2019
|
02.05.2019 |
1.67 EUR |
|
28.04.2018
|
02.05.2018 |
4.64 EUR |
|
03.05.2017
|
04.05.2017 |
0.35 EUR |
|
03.05.2017
|
04.05.2017 |
1.39 EUR |
|
03.05.2016
|
04.05.2016 |
0.2 EUR |
|
03.05.2016
|
04.05.2016 |
1 EUR |
BE Semiconductor Industries N.V. produces integrated semiconductor assembly equipment. The Company designs, develops, manufactures, markets, and services machines that manufacture semiconductor packages, which provide the connection between the chip and other electronic components and protect the chip.
