|
|
|
|
Дата |
|---|
| 18:40 |
| 06.10.2026 |
| 05.10.2026 |
| 02.10.2026 |
| 01.10.2026 |
| 30.09.2026 |
| 29.09.2026 |
| 28.09.2026 |
| 25.09.2026 |
| 24.09.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
192.00
|
193.90
|
194.20
|
190.10
|
197.80
|
192.05
|
|
|
121 022 518.80
|
11 694.00
|
|
192.00
|
193.90
|
194.20
|
190.10
|
197.80
|
192.05
|
|
|
121 022 518.80
|
11 694.00
|
|
201.40
|
203.60
|
205.50
|
200.10
|
208.40
|
203.00
|
|
|
85 267 730.80
|
7 009.00
|
|
204.00
|
205.00
|
194.80
|
192.65
|
208.90
|
204.80
|
|
|
146 888 840.08
|
10 845.00
|
|
190.50
|
192.20
|
196.00
|
187.85
|
196.90
|
191.40
|
|
|
107 284 240.95
|
12 651.00
|
|
191.50
|
194.00
|
192.50
|
191.50
|
195.20
|
191.80
|
|
|
76 134 841.43
|
5 752.00
|
|
192.50
|
193.00
|
187.65
|
186.95
|
193.95
|
192.50
|
|
|
84 713 826.10
|
7 564.00
|
|
184.35
|
185.90
|
184.95
|
183.50
|
189.15
|
184.35
|
|
|
67 765 533.43
|
5 736.00
|
|
187.00
|
187.75
|
190.20
|
186.50
|
191.10
|
187.60
|
|
|
60 270 201.18
|
4 821.00
|
|
186.60
|
188.50
|
190.00
|
185.05
|
190.10
|
187.40
|
|
|
63 064 806.65
|
5 630.00
|
Период |
|---|
| 2026, регулярные |
| 2025, регулярные |
| 2024, регулярные |
| 2019, регулярные |
| 2018, регулярные |
| 2017, регулярные |
| 2016, Внеплановые |
| 2016, регулярные |
| 2015, Внеплановые |
| 2015, регулярные |
|
Экс-дивидендная дата
|
Закрытие реестра |
Сумма выплаты |
|---|---|---|
|
27.04.2026
|
28.04.2026 |
1.58 EUR |
|
25.04.2025
|
28.04.2025 |
2.18 EUR |
|
29.04.2024
|
30.04.2024 |
2.15 EUR |
|
05.05.2020
|
06.05.2020 |
1.01 EUR |
|
30.04.2019
|
02.05.2019 |
1.67 EUR |
|
28.04.2018
|
02.05.2018 |
4.64 EUR |
|
03.05.2017
|
04.05.2017 |
0.35 EUR |
|
03.05.2017
|
04.05.2017 |
1.39 EUR |
|
03.05.2016
|
04.05.2016 |
0.2 EUR |
|
03.05.2016
|
04.05.2016 |
1 EUR |
BE Semiconductor Industries N.V. produces integrated semiconductor assembly equipment. The Company designs, develops, manufactures, markets, and services machines that manufacture semiconductor packages, which provide the connection between the chip and other electronic components and protect the chip.
