|
|
|
|
Дата |
|---|
| 05.08.2025 |
| 04.08.2025 |
| 01.08.2025 |
| 31.07.2025 |
| 30.07.2025 |
| 29.07.2025 |
| 28.07.2025 |
| 25.07.2025 |
| 24.07.2025 |
| 23.07.2025 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
115.00
|
116.50
|
119.30
|
114.90
|
120.40
|
115.30
|
|
|
33 748 069.40
|
3 054.00
|
|
117.80
|
118.60
|
118.65
|
117.75
|
119.40
|
118.40
|
|
|
31 543 729.35
|
2 694.00
|
|
117.00
|
117.35
|
117.60
|
115.70
|
118.55
|
117.15
|
|
|
35 384 495.90
|
4 116.00
|
|
119.00
|
119.35
|
123.35
|
117.70
|
124.85
|
119.10
|
|
|
63 750 069.25
|
5 520.00
|
|
121.00
|
123.00
|
120.35
|
120.05
|
123.35
|
122.40
|
|
|
34 308 651.65
|
3 020.00
|
|
119.65
|
122.30
|
123.05
|
119.45
|
123.15
|
120.00
|
|
|
43 034 000.18
|
3 982.00
|
|
122.20
|
122.90
|
120.95
|
120.20
|
124.25
|
122.80
|
|
|
64 452 399.08
|
5 642.00
|
|
117.00
|
118.95
|
125.45
|
116.65
|
125.65
|
117.10
|
|
|
108 989 831.40
|
11 372.00
|
|
126.90
|
128.95
|
124.00
|
124.00
|
134.15
|
127.00
|
|
|
145 329 303.75
|
14 825.00
|
|
123.50
|
124.25
|
125.65
|
123.10
|
126.45
|
123.65
|
|
|
66 717 181.00
|
6 123.00
|
Период |
|---|
| 2025, регулярные |
| 2024, регулярные |
| 2019, регулярные |
| 2018, регулярные |
| 2017, регулярные |
| 2016, Внеплановые |
| 2016, регулярные |
| 2015, Внеплановые |
| 2015, регулярные |
| 2014, регулярные |
|
Экс-дивидендная дата
|
Закрытие реестра |
Сумма выплаты |
|---|---|---|
|
25.04.2025
|
28.04.2025 |
2.18 EUR |
|
29.04.2024
|
30.04.2024 |
2.15 EUR |
|
05.05.2020
|
06.05.2020 |
1.01 EUR |
|
30.04.2019
|
02.05.2019 |
1.67 EUR |
|
28.04.2018
|
02.05.2018 |
4.64 EUR |
|
03.05.2017
|
04.05.2017 |
0.35 EUR |
|
03.05.2017
|
04.05.2017 |
1.39 EUR |
|
03.05.2016
|
04.05.2016 |
0.2 EUR |
|
03.05.2016
|
04.05.2016 |
1 EUR |
|
05.05.2015
|
06.05.2015 |
1.5 EUR |
BE Semiconductor Industries N.V. produces integrated semiconductor assembly equipment. The Company designs, develops, manufactures, markets, and services machines that manufacture semiconductor packages, which provide the connection between the chip and other electronic components and protect the chip.
