|
|
|
|
Дата |
|---|
| 14:15 |
| 02.12.2025 |
| 01.12.2025 |
| 28.11.2025 |
| 27.11.2025 |
| 26.11.2025 |
| 25.11.2025 |
| 24.11.2025 |
| 21.11.2025 |
| 20.11.2025 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
135.15
|
135.25
|
133.85
|
133.55
|
136.50
|
135.20
|
|
|
19 951 695.45
|
2 144.00
|
|
131.20
|
132.00
|
129.50
|
129.45
|
133.10
|
131.35
|
|
|
51 835 232.10
|
5 553.00
|
|
129.60
|
130.25
|
129.60
|
127.60
|
132.00
|
129.75
|
|
|
41 283 260.60
|
3 406.00
|
|
129.75
|
130.10
|
130.00
|
129.25
|
130.40
|
129.90
|
|
|
37 048 162.60
|
2 784.00
|
|
129.80
|
131.00
|
129.45
|
128.80
|
131.35
|
129.90
|
|
|
24 329 124.30
|
2 475.00
|
|
128.50
|
129.60
|
126.10
|
125.15
|
129.60
|
129.60
|
|
|
50 084 112.20
|
4 364.00
|
|
123.90
|
125.00
|
125.30
|
121.00
|
125.90
|
124.60
|
|
|
47 725 745.15
|
4 466.00
|
|
123.90
|
125.00
|
124.65
|
123.20
|
125.60
|
124.40
|
|
|
79 453 978.10
|
3 910.00
|
|
122.60
|
123.40
|
124.20
|
120.15
|
124.90
|
122.80
|
|
|
99 386 292.05
|
10 068.00
|
|
130.00
|
130.25
|
133.50
|
130.05
|
135.65
|
130.05
|
|
|
54 324 281.30
|
5 285.00
|
Период |
|---|
| 2025, регулярные |
| 2024, регулярные |
| 2019, регулярные |
| 2018, регулярные |
| 2017, регулярные |
| 2016, Внеплановые |
| 2016, регулярные |
| 2015, Внеплановые |
| 2015, регулярные |
| 2014, регулярные |
|
Экс-дивидендная дата
|
Закрытие реестра |
Сумма выплаты |
|---|---|---|
|
25.04.2025
|
28.04.2025 |
2.18 EUR |
|
29.04.2024
|
30.04.2024 |
2.15 EUR |
|
05.05.2020
|
06.05.2020 |
1.01 EUR |
|
30.04.2019
|
02.05.2019 |
1.67 EUR |
|
28.04.2018
|
02.05.2018 |
4.64 EUR |
|
03.05.2017
|
04.05.2017 |
0.35 EUR |
|
03.05.2017
|
04.05.2017 |
1.39 EUR |
|
03.05.2016
|
04.05.2016 |
0.2 EUR |
|
03.05.2016
|
04.05.2016 |
1 EUR |
|
05.05.2015
|
06.05.2015 |
1.5 EUR |
BE Semiconductor Industries N.V. produces integrated semiconductor assembly equipment. The Company designs, develops, manufactures, markets, and services machines that manufacture semiconductor packages, which provide the connection between the chip and other electronic components and protect the chip.
