|
|
|
|
Дата |
|---|
| 20.02.2026 |
| 19.02.2026 |
| 18.02.2026 |
| 17.02.2026 |
| 16.02.2026 |
| 13.02.2026 |
| 12.02.2026 |
| 11.02.2026 |
| 10.02.2026 |
| 09.02.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
183.00
|
185.00
|
176.00
|
175.775
|
185.10
|
184.50
|
|
|
129 058 151.08
|
10 282.00
|
|
172.85
|
173.70
|
181.40
|
171.55
|
181.70
|
173.00
|
|
|
138 267 367.15
|
13 575.00
|
|
185.00
|
189.20
|
180.05
|
180.00
|
189.10
|
187.00
|
|
|
111 215 732.58
|
8 138.00
|
|
180.00
|
181.00
|
176.60
|
172.30
|
181.05
|
180.10
|
|
|
63 179 640.20
|
5 686.00
|
|
177.00
|
179.00
|
176.50
|
175.05
|
178.50
|
178.50
|
|
|
32 599 283.20
|
2 863.00
|
|
175.05
|
176.50
|
172.30
|
170.15
|
176.75
|
176.20
|
|
|
112 944 253.00
|
8 149.00
|
|
168.00
|
170.40
|
173.00
|
168.70
|
173.80
|
168.70
|
|
|
62 391 176.30
|
5 559.00
|
|
169.80
|
172.20
|
168.85
|
167.00
|
172.45
|
170.90
|
|
|
47 262 866.15
|
3 973.00
|
|
168.90
|
170.00
|
166.80
|
165.55
|
170.35
|
169.05
|
|
|
48 732 419.73
|
4 289.00
|
|
166.00
|
167.80
|
168.20
|
165.25
|
168.50
|
167.40
|
|
|
43 762 700.30
|
3 704.00
|
Период |
|---|
| 2025, регулярные |
| 2024, регулярные |
| 2019, регулярные |
| 2018, регулярные |
| 2017, регулярные |
| 2016, Внеплановые |
| 2016, регулярные |
| 2015, Внеплановые |
| 2015, регулярные |
| 2014, регулярные |
|
Экс-дивидендная дата
|
Закрытие реестра |
Сумма выплаты |
|---|---|---|
|
25.04.2025
|
28.04.2025 |
2.18 EUR |
|
29.04.2024
|
30.04.2024 |
2.15 EUR |
|
05.05.2020
|
06.05.2020 |
1.01 EUR |
|
30.04.2019
|
02.05.2019 |
1.67 EUR |
|
28.04.2018
|
02.05.2018 |
4.64 EUR |
|
03.05.2017
|
04.05.2017 |
0.35 EUR |
|
03.05.2017
|
04.05.2017 |
1.39 EUR |
|
03.05.2016
|
04.05.2016 |
0.2 EUR |
|
03.05.2016
|
04.05.2016 |
1 EUR |
|
05.05.2015
|
06.05.2015 |
1.5 EUR |
BE Semiconductor Industries N.V. produces integrated semiconductor assembly equipment. The Company designs, develops, manufactures, markets, and services machines that manufacture semiconductor packages, which provide the connection between the chip and other electronic components and protect the chip.
