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Дата |
|---|
| 20:17 |
| 24.02.2026 |
| 23.02.2026 |
| 20.02.2026 |
| 19.02.2026 |
| 18.02.2026 |
| 17.02.2026 |
| 13.02.2026 |
| 12.02.2026 |
| 11.02.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
118.92
|
119.55
|
118.40
|
116.685
|
119.18
|
119.18
|
|
|
6 311 454.87
|
1 381.00
|
|
113.11
|
117.00
|
112.50
|
112.50
|
117.67
|
116.79
|
|
|
7 989 660.19
|
2 151.00
|
|
111.60
|
113.91
|
112.50
|
110.33
|
113.50
|
111.68
|
|
|
6 494 410.27
|
1 508.00
|
|
111.05
|
114.10
|
111.68
|
111.37
|
115.93
|
113.45
|
|
|
7 030 855.55
|
1 660.00
|
|
110.07
|
113.93
|
113.04
|
110.79
|
114.90
|
112.85
|
|
|
3 884 057.41
|
1 135.00
|
|
113.35
|
115.00
|
112.00
|
111.65
|
117.03
|
115.26
|
|
|
10 803 250.06
|
2 117.00
|
|
112.00
|
113.90
|
111.15
|
108.18
|
113.10
|
111.95
|
|
|
6 730 956.49
|
1 450.00
|
|
110.38
|
114.87
|
109.34
|
108.89
|
113.65
|
111.70
|
|
|
10 392 198.09
|
1 821.00
|
|
108.08
|
110.65
|
115.70
|
107.83
|
117.40
|
108.54
|
|
|
9 621 944.31
|
2 248.00
|
|
115.23
|
117.00
|
110.62
|
109.06
|
114.85
|
114.49
|
|
|
12 515 654.93
|
2 330.00
|
Qnity Electronics, Inc. is engaged in providing materials and solutions for semiconductor and electronics industries. The Company has two business segments, namely Semiconductor Technologies and Interconnect Solutions. The Semiconductor Technologies segment provides a portfolio of materials and solutions utilized across multiple stages of the semiconductor manufacturing process. These materials are integrated into customers’ roadmaps and are intended to support improvements in chip performance, production yield, and the implementation of advanced node technologies. The Interconnect Solutions segment offers a comprehensive range of material solutions that address the complexities of signal integrity, thermal and power management, and advanced packaging.
These solutions are used in advanced electronics hardware applications, including complex printed circuit boards and advanced semiconductor packaging.
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