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Дата |
|---|
| 07:32 |
| 02.11.2026 |
| 30.10.2026 |
| 29.10.2026 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
|---|---|---|---|---|---|---|---|
|
1.50
|
1.50
|
1.45
|
1.44
|
1.55
|
1.50
|
|
|
804 622.00
|
475.00
|
|
1.45
|
1.46
|
1.47
|
1.40
|
1.51
|
1.45
|
|
|
3 882 754.00
|
|
|
1.50
|
1.51
|
1.80
|
1.46
|
1.80
|
1.51
|
|
|
19 566 693.00
|
|
|
1.80
|
1.81
|
1.82
|
1.80
|
1.82
|
1.80
|
|
|
4 352 044.00
|
|
We are one of the leading manufacturers of semiconductor advanced packaging materials, established in Tainan, Taiwan in 1998, with over 28 years of operating experience in the electronics and semiconductor industry, operating under our corporate brand "Accurus". We are principally engaged in the design, development, manufacturing and commercialisation of precision solder spheres, which serve as critical interconnect components enabling electrical conductivity between integrated circuits and printed circuit boards across a broad spectrum of advanced semiconductor packaging applications. Our products and solutions are mainly used in end-user applications such as high-performance computing for artificial intelligence, memory (including high bandwidth memory), mobile devices and wearables, and automotive applications.