Показано 0 из 0
Дата |
---|
17.05.2024 |
16.05.2024 |
15.05.2024 |
14.05.2024 |
13.05.2024 |
10.05.2024 |
09.05.2024 |
08.05.2024 |
07.05.2024 |
06.05.2024 |
Bid | Ask |
Open |
Min | Max |
Last |
Legal close |
Avg |
Оборот |
Кол-во сделок |
---|---|---|---|---|---|---|---|
|
|
68.92
|
67.13
|
70.00
|
69.81
|
|
|
119 866 250.00
|
|
|
|
69.10
|
68.41
|
70.50
|
69.40
|
|
|
150 425 386.00
|
|
|
|
65.84
|
65.01
|
70.90
|
67.70
|
|
|
176 295 478.00
|
|
|
|
66.59
|
65.19
|
67.49
|
65.84
|
|
|
109 107 876.00
|
|
|
|
66.85
|
65.59
|
68.56
|
66.00
|
|
|
170 768 036.00
|
|
|
|
74.39
|
70.63
|
74.55
|
70.87
|
|
|
152 367 653.00
|
|
|
|
73.59
|
72.59
|
76.50
|
74.46
|
|
|
178 678 326.00
|
|
|
|
75.00
|
72.20
|
75.40
|
72.69
|
|
|
181 523 885.00
|
|
|
|
75.80
|
74.36
|
76.67
|
75.40
|
|
|
169 866 835.00
|
|
|
|
75.09
|
74.30
|
77.09
|
75.40
|
|
|
201 698 346.00
|
|
Jiangsu HHCK Advanced Materials Co.,Ltd. manufactures and distributes semiconductor packaging materials. The Company produces epoxy molding compound, electronic adhesive, and more. Jiangsu HHCK Advanced Materials conducts businesses in China.